Friday 21 December 2018

IBM, Samsung Ink Agreement to Build Future Power Chips


IBM and Samsung have signed a deal for Samsung to build Power chips on its 7nm process.

The post IBM, Samsung Ink Agreement to Build Future Power Chips appeared first on ExtremeTech.



from ExtremeTechExtremeTech https://www.extremetech.com/computing/282766-ibm-samsung-ink-agreement-to-build-future-power-chips

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