Tuesday 26 July 2016

Moore’s law scaling dead by 2021, to be replaced by 3D integration

a-silicon-wafer-in-sand-maybe
A new semiconductor report projects that 2D planar scaling will end by 2021, replaced by 3D logic integration and stacked chips -- but how will this affect long-term device scaling and overall performance?

from ExtremeTechExtremeTech http://www.extremetech.com/extreme/232342-moores-law-scaling-dead-by-2021-to-be-replaced-by-3d-integration

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